Key Features

• 99.9% Pure Micronized Silver — Maximizes particle-to-particle contact for superior heat transfer
• 88%+ Thermally Conductive Filler — Silver + zinc oxide, aluminum oxide, and boron nitride for enhanced conductivity
• Triple-Phase Viscosity — Thins on first use to fill surface gaps, stabilizes over 50–200 hours
• Not Electrically Conductive — Safe for CPU and GPU applications
• No Silicone — Polysynthetic Oil Base — Will not separate, run, or migrate over time
• -50°C to 180°C Peak Range — Stable across all desktop and workstation thermal conditions
• 1, 2, 5, and 10-Piece Packs — 3.5g per tube covers 15–25 small or 6–10 large CPU cores

Arctic Silver 5 is one of the most widely used and trusted high-performance thermal compounds available, built around a high-density polysynthetic silver formulation that has been the reference standard for enthusiasts and professionals for decades. Each 3.5g tube contains over 88% thermally conductive filler by weight — combining micronized pure silver with sub-micron ceramic particles to fill microscopic surface irregularities between CPU and heatsink more effectively than standard pastes.

The triple-phase viscosity behavior sets Arctic Silver 5 apart from single-viscosity compounds. Fresh from the syringe it applies easily; it thins under initial heat to maximize surface contact; then stabilizes over 50–200 hours of use into its final long-term consistency. The result is a compound that improves slightly after break-in and then remains stable indefinitely without separation, migration, or bleed. Available in 1, 2, 5, and 10-piece packs, it suits everything from a single build to a professional workshop.

Ideal For

• CPU Heatsink & Water Cooling — Optimized for high-power CPUs with air coolers or custom water loops
• Overclockers & Enthusiasts — High-density silver formulation delivers 3–12°C lower temps vs standard compounds
• Professional PC Builders & Workshops — Multi-pack options (2, 5, 10 tubes) cover multiple systems efficiently
• Long-Term Stable Builds — Non-separating, non-migrating formula stays effective for years without reapplication
• GPU & Console Repasting — Non-conductive formula safe for GPU die and sensitive component work

Variant Options

• 1 Piece (3.5g) — MPN: AS5-3.5G
• 2 Pieces (7g total) — MPN: AS5-3.5G ×2 
• 5 Pieces (17.5g total) — MPN: AS5-3.5G ×5 
• 10 Pieces (35g total) — MPN: AS5-3.5G ×10 

Specifications

• Silver Content — 99.9% pure micronized silver
• Filler by Weight — Over 88% thermally conductive
• Particle Size — Less than 0.49 micron
• Peak Temperature Range — -50°C to 180°C
• Long-Term Temperature Range — -50°C to 130°C
• Electrical Conductivity — Not electrically conductive (slightly capacitive)
• Separation/Migration — None — absolute stability
• Coverage (3.5g) — 15–25 small CPU cores, 6–10 large CPU cores, or ~16 sq in at 0.003" thick