Thermal Grizzly

DELID-DIE-MATE TG-DDM-R7000-R The Ryzen 7000 Delid-Die-Mate is a tool for removing the heat spreaders ("delidding") on AMD Ryzen 7000 processors. By removing the heat spreader, the CPUs can be cooled...

CPU LAPPING TOOL TG-LT-aR700 The Ryzen 7000 Lapping Tool was developed for grinding the heat spreaders of the AM5 processor series from AMD. The tolerances of the Ryzen 7000 Lapping Tool allow...

CPU LAPPING TOOL TG-LT-i13G The 13th/14th Gen Lapping Tool for Intel CPUs allows safe grinding of the heatspreader. The CPU is mounted onto the tool and the removal of 0.2mm is possible. Also...

CPU Contact Frame (TG-CF-i13G) With the Intel 13th/14th Gen CPU Contact Frame by der8auer we have updated the well-known mounting aid for Intel mainboards with socket LGA1700. Compared to...

KryoSheet (TG-KS-24-12) The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar...

KryoSheet (TG-KS-29-25) The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar...

KryoSheet (TG-KS-38-38) The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar...

KryoSheet (TG-KS-50-50) The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar...

Conductonaut Extreme (TG-CE-001-R) The Conductonaut Extreme liquid metal thermal compound is the further development of Conductonaut and was developed for applications with maximum power density. As...

Direct Die Frame (TG-DDF-R7000-R) The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame for mounting Ryzen 7000* processors without the integrated heat spreader. By omitting the heat spreader,...

Hydronaut (TG-H-001-RS) Hydronaut can be used for overclocking due to it's excellent thermal conductivity, but it was created specifically for users with larger-scale cooling solutions, who are...

The thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically...

Minus Pad Extreme (TG-MPE-120-20-15-R) The minus pad extreme thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible...

The thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically...