Thermal Compounds

KryoSheet (TG-KS-24-12) The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with...

KryoSheet (TG-KS-29-25) The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with...

KryoSheet (TG-KS-38-38) The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with...

KryoSheet (TG-KS-50-50) The graphene thermal pads of the Thermal Grizzly KryoSheet series can be used as an excellent alternative for thermal compounds from the higher performance segment. Similar to Carbonaut pads, they have a conformable surface with...

Gelid Solutions GC-4-1g Thermal Compound The Gelid Solutions GC-4-1g Thermal Compound is a state-of-the-art thermal compound designed for professional and extreme users who require the best thermal interface for their CPUs, GPUs, chipsets, and other...

Gelid Solutions GC-4-3.5g Thermal Compound The Gelid Solutions GC-4-3.5g Thermal Compound is a state-of-the-art thermal compound designed for professional and extreme users who require the best thermal interface for their CPUs, GPUs, chipsets, and other...

Conductonaut Extreme (TG-CE-001-R) The Conductonaut Extreme liquid metal thermal compound is the further development of Conductonaut and was developed for applications with maximum power density. As a gallium-based liquid metal, Conductonaut Extreme is...

Direct Die Frame (TG-DDF-R7000-R) The AMD Ryzen 7000 Direct Die Frame is a CPU mounting frame for mounting Ryzen 7000* processors without the integrated heat spreader. By omitting the heat spreader, the CPU cooler can be mounted directly on the...

The cutting-edge Thermal Compound Created for Extreme Users on highest level the GC-Extreme thermal compound achieves the best heat conductivity from your CPU, VGA or even Chipset to your cooler. The GELID applicator enables an easier application...

The cutting-edge Thermal Compound Created for Extreme Users on highest level the GC-Extreme thermal compound achieves the best heat conductivity from your CPU, VGA or even Chipset to your cooler. The GELID applicator enables an easier application...

The cutting-edge Thermal Compound Created for Extreme Users on highest level the GC-Extreme thermal compound achieves the best heat conductivity from your CPU, VGA or even Chipset to your cooler. The GELID applicator enables an easier application...

Hydronaut (TG-H-001-RS) Hydronaut can be used for overclocking due to it's excellent thermal conductivity, but it was created specifically for users with larger-scale cooling solutions, who are looking for a quality product with an excellent...

  HIGHEST THERMAL CONDUCTIVITY The surfaces of processor chips and cooler floors are covered with microscopic dents; ARCTIC‘s MX-4 thermal paste is composed of carbon microparticles which fill these cavities. This leads to extremely...